A dispensing system is not selected by industry name alone. The real inputs are part geometry, material, path, shot size, cycle time, environment and quality target.


Underfill, staking, conformal material, thermal interface, sealing
Explore →
ECU sealing, sensor potting, BMS, battery and power electronics
Explore →
Module sealing, driver potting, lens bonding and moisture protection
Explore →
Motors, power supplies, coils, connectors, appliances and general assembly
Explore →Underfill, component staking, shielding materials, thermal interface, connector sealing and potting.
ECU, BMS, sensors, battery, charging modules and power electronics.
LED modules, strips, drivers, lens bonding, waterproof sealing and potting.
Motors, coils, power supplies, pumps, connectors, appliances and general assembly.
