PRODUCT SYSTEM
Potting & Encapsulation System
Automated filling and encapsulation for electronics that need moisture, vibration, thermal or environmental protection.
PCB pottingPower suppliesBattery electronicsSensorsLED driversCoils & transformers
Automated filling and encapsulation for electronics that need moisture, vibration, thermal or environmental protection.
Potting quality depends heavily on bubble control, material conditioning and the way resin flows through the cavity. The filling strategy should be tested with the actual part.
Tank agitation, heating or degassing according to resin behavior.
1K or 2K metering selected around volume and accuracy requirement.
Single-point fill, multi-point fill, staged fill or path fill.
Manual load, fixtures, pallets or conveyor integration.
Material preparation, nozzle placement and filling speed tuned to geometry.
Room-temperature, heat-assisted or downstream cure process.
Send the part photo, adhesive TDS, path and target cycle time to narrow down valve, fluid supply and automation architecture.