APPLICATION
Electronics & PCB Dispensing
Underfill, component staking, thermal materials, connector sealing, gasketing and potting across PCB and electronic assembly.
Underfill, component staking, thermal materials, connector sealing, gasketing and potting across PCB and electronic assembly.
Visual examples of how dispensing, potting, thermal materials, 2K mixing, vision and inline automation are used in production.
Bonding, staking, sealing and continuous bead application.
Electrical insulation, moisture, vibration and environmental protection.
Dispensing grease, gel and gap-filling materials onto electronics and housings.
Metering, mixing and dispensing of epoxy, silicone and PU systems.
Offset compensation, mark alignment and fine-path positioning.
Automated part handling, line communication and continuous production.
Even within the same industry, material, shot profile, path, fixture, takt time and quality criteria can change the machine architecture. Selection should be based on the actual part and material.