Use these examples to understand the direction of a solution. They are representative process scenarios, not fixed customer configurations.


Underfill, thermal interface, connector sealing and PCB potting may require different valve and motion technologies.

ECU, BMS, battery and power-electronics projects often combine sealing, 2K materials and thermal management.

Lighting production may combine bonding, lens dispensing, driver potting and waterproof sealing.

Motors, coils, power supplies and connectors may need repeatable adhesive paths or encapsulation.
Start with the example closest to your geometry and dispensing area.
Viscosity, chemistry and fillers can change the valve and feed system.
Cycle time often determines whether a bench-top, vision or inline platform makes sense.