Epoxy
2K structural bonding, potting and encapsulation.
MATERIALS
Materials & Adhesive Compatibility
Material behavior determines the fluid supply, valve and mixing architecture.
Material behavior determines the fluid supply, valve and mixing architecture.
2K structural bonding, potting and encapsulation.
Sealing, thermal management and electronics protection.
Flexible bonding and encapsulation.
Fast-curing optical and electronic assembly.
Thermal grease, gels and gap fillers.
Housing sealing and moisture protection.
High viscosity may need stronger feed pressure or larger flow paths.
Abrasive or conductive fillers affect valve and pump selection.
2K ratio stability affects metering and mixing design.
Heat, UV, moisture or room-temperature cure changes the process.
Micro dots, continuous beads and potting need different technologies.
Bubble-sensitive potting may need vacuum or material conditioning.
Share the part, adhesive and target cycle time to start a practical configuration.