A dispensing system is not selected by industry name alone. The real inputs are part geometry, material, path, shot size, cycle time, environment and quality target.

Underfill, component staking, shielding materials, thermal interface, connector sealing and potting.
ECU, BMS, sensors, battery, charging modules and power electronics.
LED modules, strips, drivers, lens bonding, waterproof sealing and potting.
Motors, coils, power supplies, pumps, connectors, appliances and general assembly.


Bonding, staking, sealing and continuous bead application.

Electrical insulation, moisture, vibration and environmental protection.

Dispensing grease, gel and gap-filling materials onto electronics and housings.

Metering, mixing and dispensing of epoxy, silicone and PU systems.

Offset compensation, mark alignment and fine-path positioning.

Automated part handling, line communication and continuous production.